Grid special processing method based on two-dimensional simulation cutting

The invention discloses a special grid processing method based on two-dimensional simulation cutting. The method comprises the following steps: establishing a workpiece model and a cutter model in Abaqus drawing software; segmenting the workpiece to establish a chip layer; establishing a damaged layer; cutting a chip layer, and making a base line for grid optimization; setting material parameters of the processed workpiece according to material characteristics of the processed workpiece; establishing an analysis step; dividing grids for the workpiece; performing grid division on the tool model; setting contact attributes of the two-dimensional finite element model of the cutter and the two-dimensional finite element model of the workpiece, selecting surface-surface contact, and setting a friction coefficient according to a material of the machined workpiece; setting boundary conditions of the workpiece two-dimensional finite element model and the tool two-dimensional finite element model; and running and stor