Manufacturing method of 5G circuit board diaphragm cushion paper and 5G circuit board diaphragm cushion paper

The invention discloses a manufacturing method of 5G circuit board diaphragm cushion paper. The manufacturing method comprises the following steps: selection of raw materials: selecting 50%-60% of needle-leaved wood chips, 20%-30% of broad-leaved wood chips and 10%-20% of bamboo chips; cooking and pulping: mixing the selected raw materials, and cooking the mixture to obtain pulp; pulping: pulping the prepared pulp; auxiliary materials addition: adding a flame retardant system to an inlet of a slushing pump of a slurry sizing system, wherein the adding amount is 15-20% of the absolute dry slurry amount; performing mesh forming; performing squeezing; performing drying; calendaring the paper; and coiling the sheet. According to the manufacturing method of the 5G circuit board diaphragm cushion paper, the used raw materials are easy to obtain and low in cost, and the 5G circuit board diaphragm cushion paper has the heat resistance of resisting the high temperature of 280-320 DEG C, good smoothness and good air pe