Method for pressing warpage of PCB

The invention belongs to the technical field of PCB correction, particularly relates to a method for pressing warpage of a PCB, and solves the problems that in the prior art, 20% of deformation of the PCB exceeds the standard in the actual production and machining process, the correction efficiency of an existing PCB is low, and production requirements cannot be met. The method for pressing warpage of the PCB comprises the following steps of putting qualified plates into a baking oven for baking treatment, collecting and stacking the plates on a flat and clean table board after baking is finished, putting a glass fiber plate on the plates, then pressing a mold block and removing the mold block after cooling. According to the method, the deformed PCB can be corrected, the correction effect is good, and the correction efficiency is greatly improved compared with that of an existing correction method; and the PCB is corrected in a manner of conducting pressing and cooling at the same time, so that the quality of