Assembly with heat sink core element forming supporting structure

The invention relates to an assembly of an electrical device (1), which includes: at least one electrical functional assembly which has a supporting element (13-16) and electrical or electronic functional components (18) arranged on the supporting element (13-16); a fastening device (12) for fasteni...

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Hauptverfasser: WELSLAU FABIO, BEST FRANK
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention relates to an assembly of an electrical device (1), which includes: at least one electrical functional assembly which has a supporting element (13-16) and electrical or electronic functional components (18) arranged on the supporting element (13-16); a fastening device (12) for fastening the electrical device (1) to a higher-level assembly. The assembly also comprises a heat sink core element (11) having at least one planar wall (110, 113, 115); and an external element (100, 11A-11D) connectable to the heat sink core element (11). The heat sink core element (11) forms a supporting structure of the electrical device (1) on which supporting structure the fastening device (12) is arranged. The external element (100, 11A-11D) is connectable to the heat sink core element (11) such that the functional assembly is accommodated between the at least one planar wall (110, 113, 115) of the heat sink core element (11) and the external element (100, 11A-11D). 本发明涉及一种电气设备(1)的组件,包括:至少一个电气功能组件,其具有载体元件(13-16)和布置