Semiconductor Package Having Reinforcement Layer

A semiconductor package having a reinforcement layer is provided. The semiconductor package is provided and may include a substrate, a chip stack disposed on the substrate, the chip stack including a plurality of semiconductor chips, a plurality of bonding wires electrically connecting the substrate to the plurality of semiconductor chips, a reinforcement layer disposed on the chip stack, and a molding layer surrounding side surfaces of the chip stack and the bonding wires and contacting side surfaces of the reinforcement layer. The reinforcement layer may include a lower layer including an adhesive, an intermediate layer disposed on the lower layer, and an upper layer disposed on the intermediate layer. The intermediate layer may have elongation in a range of 5% to 70%. The upper layer may have elongation less than 5%. 具有增强层的半导体封装件。提供了半导体封装件。半导体封装件可以包括：基板，芯片层叠物，其设置在基板上，该芯片层叠物包括多个半导体芯片；多条接合布线，其将基板电连接至多个半导体芯片；增强层，其设置在芯片层叠物上；以及模制层，其围绕芯片层叠物的侧表面和接合布线并且接触增强层的侧表面。增强层可以包括：下层，其包括粘合剂；中间层，其设置在下层上，以及上层，其设置在中间层上。中间层可以具有在