VACUUM PROCESSING APPARATUS AND VACUUM PROCESSING METHOD

A vacuum processing apparatus includes: a processing unit comprising a processing chamber disposed in a vacuum container; and a detector detecting a thickness of the target film on a wafer or an end point during the processing of the wafer using a light from the wafer, the detector being functioned to detect the thickness or the end point by comparing a data pattern of obtained in advance indicating light intensities of a plurality of wavelengths related to the film thickness using the wavelength as a parameter and a real data pattern indicating the light intensities of the plurality of wavelengths obtained at a particular time during the processing, and the data pattern being obtained by dividing differential coefficient value of time-series data of the light intensities of the plurality of wavelengths by time-series data indicating values of the light intensities of the plurality of wavelengths. 一种真空处理装置，包括：处理单元，包括：设置在真空容器中的处理室；检测器，使用来自晶片的光在处理晶片期间检测晶片上的对象膜的厚度或终点，该检测器通过将预先获得的数据模式与真实数据模式进行比较来检测厚度或终点，预先获得的数据模式