EWIS bending radius analysis method
The invention provides an EWIS bending radius analysis method, which comprises the steps of data collection and conversion; obtaining information of a Bundle Segment in the three-dimensional wire harness; performing data interaction; generating the corresponding information of the Bundle Segment and...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides an EWIS bending radius analysis method, which comprises the steps of data collection and conversion; obtaining information of a Bundle Segment in the three-dimensional wire harness; performing data interaction; generating the corresponding information of the Bundle Segment and the diameter of the wire harness; correcting the minimum bending radius multiple; data conversion; performing secondary data interaction; displaying a structure, and the like, wherein a display result comprises a table form and a three-dimensional graphic form; according to the intelligent EWIS bending radius analysis method provided by the invention, the three-dimensional wire harness information is subjected to information interaction with the wire table and the wire model information table, the diameter of the wire harness is automatically calculated, the value of the bending radius which does not meet the design requirement and the position information of the bending radius are captured, the workload of repeat |
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