POWER SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICE

A conductive wire (20) is connected to a front electrode (17) of a semiconductor element (15) at a connection part (21). A first resin member (30) covers at least one of both end parts (21p, 21q) of the connection part (21), a first surface (17a) of the front electrode (17), and a second surface (20a) of the conductive wire (20). A second resin member (33) covers a bent part (31) of the first resin member (30). The first resin member (30) has a higher elongation at break and a higher break strength than the second resin member (33). The second resin member (33) has a second tensile modulus that is higher than a first tensile modulus of the first resin member (30). A power semiconductor module (1) has improved reliability. 导电线(20)在接合部(21)与半导体元件(15)的前面电极(17)接合。第1树脂部件(30)覆盖接合部(21)的两端部(21p、21q)的至少一个端部、前面电极(17)的第1表面(17a)以及导电线(20)的第2表面(20a)。第2树脂部件(33)覆盖第1树脂部件(30)的弯曲部(31)。第1树脂部件(30)具有比第2树脂部件(33)高的断裂伸长率以及高的断裂强度。第2树脂部件(33)的第2拉伸弹性模量高于第1树脂部件(30)的第1拉伸弹性模量。功率半导体模块(1)具有提高的可靠性。