Circuit substrate and manufacturing method thereof

The invention discloses a circuit substrate and a manufacturing method thereof. The circuit substrate comprises a patterned substrate, a patterned insulating structure and signal lines. The patterned insulating structure includes a plurality of device portions and a plurality of circuit portions. The plurality of device portions are located on the patterned substrate. The plurality of circuit portions are located on the patterned substrate and are connected with the corresponding device portions. The at least one circuit portion includes an ion-doped first insulating portion and a second insulating portion connected to the first insulating portion. The plurality of signal lines are located on the first insulating portion. 一种电路基底及其制造方法，电路基底包括图案化基底、图案化绝缘结构以及信号线。图案化绝缘结构包括多个装置部以及多个线路部。多个装置部位于图案化基底上。多个线路部位于图案化基底上，且连接对应的装置部。至少一个线路部包含经离子掺杂的第一绝缘部以及相连第一绝缘部的第二绝缘部。多条信号线位于第一绝缘部上。