SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

In an embodiment of the invention, a semiconductor package includes an interposer, a die, a protective layer, a plurality of first electrical connectors, and a first molding material. The die includes a first surface and a second surface opposite the first surface, and the die is bonded to the interposer through the first surface. A protective layer is disposed on the second surface of the die. The first electrical connector is disposed alongside the die. The first molding material is disposed beside the die, the protective layer, and the first electrical connector. 在本发明实施例中，一种半导体封装包括中介件、管芯、保护层、多个第一电连接件及第一模制材料。管芯包括第一表面及与第一表面相对的第二表面，且管芯通过第一表面结合到中介件。保护层设置在管芯的第二表面上。第一电连接件设置在管芯旁边。第一模制材料设置在管芯、保护层及第一电连接件旁边。