Electrode evaporation equipment and method thereof
The invention provides electrode evaporation equipment and a method thereof, and belongs to the field of light emitting diode manufacturing. A plating pot comprises an installing plate and a plurality of supporting units, the supporting units are evenly distributed on the plate face of the installin...
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| creator | LI JUNSHENG SUN HU HU GENSHUI ZHANG SHENGJUN |
| description | The invention provides electrode evaporation equipment and a method thereof, and belongs to the field of light emitting diode manufacturing. A plating pot comprises an installing plate and a plurality of supporting units, the supporting units are evenly distributed on the plate face of the installing plate, each supporting unit comprises a plurality of telescopic rods and a substrate fixing plate, a substrate of an epitaxial wafer is installed on the substrate fixing plate, the two ends of the multiple telescopic rods in the supporting unit are connected to the installing plate and one end face of the substrate fixing plate correspondingly in a hinged mode, the multiple telescopic rods are distributed in the circumferential direction, the telescopic rods between the substrate fixing plate and the installing plate of the plating pot are controlled to be stretched or shortened, the substrate fixing plate is adjusted to a proper position, so that the shielding of photoresist is avoided, the offset influence of g |
| format | Patent |
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A plating pot comprises an installing plate and a plurality of supporting units, the supporting units are evenly distributed on the plate face of the installing plate, each supporting unit comprises a plurality of telescopic rods and a substrate fixing plate, a substrate of an epitaxial wafer is installed on the substrate fixing plate, the two ends of the multiple telescopic rods in the supporting unit are connected to the installing plate and one end face of the substrate fixing plate correspondingly in a hinged mode, the multiple telescopic rods are distributed in the circumferential direction, the telescopic rods between the substrate fixing plate and the installing plate of the plating pot are controlled to be stretched or shortened, the substrate fixing plate is adjusted to a proper position, so that the shielding of photoresist is avoided, the offset influence of g</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211224&DB=EPODOC&CC=CN&NR=113832443A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211224&DB=EPODOC&CC=CN&NR=113832443A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LI JUNSHENG</creatorcontrib><creatorcontrib>SUN HU</creatorcontrib><creatorcontrib>HU GENSHUI</creatorcontrib><creatorcontrib>ZHANG SHENGJUN</creatorcontrib><title>Electrode evaporation equipment and method thereof</title><description>The invention provides electrode evaporation equipment and a method thereof, and belongs to the field of light emitting diode manufacturing. A plating pot comprises an installing plate and a plurality of supporting units, the supporting units are evenly distributed on the plate face of the installing plate, each supporting unit comprises a plurality of telescopic rods and a substrate fixing plate, a substrate of an epitaxial wafer is installed on the substrate fixing plate, the two ends of the multiple telescopic rods in the supporting unit are connected to the installing plate and one end face of the substrate fixing plate correspondingly in a hinged mode, the multiple telescopic rods are distributed in the circumferential direction, the telescopic rods between the substrate fixing plate and the installing plate of the plating pot are controlled to be stretched or shortened, the substrate fixing plate is adjusted to a proper position, so that the shielding of photoresist is avoided, the offset influence of g</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDByzUlNLinKT0lVSC1LLMgvSizJzM9TSC0szSzITc0rUUjMS1HITS3JyE9RKMlILUrNT-NhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGxhbGRiYmxo7GxKgBAPiALGs</recordid><startdate>20211224</startdate><enddate>20211224</enddate><creator>LI JUNSHENG</creator><creator>SUN HU</creator><creator>HU GENSHUI</creator><creator>ZHANG SHENGJUN</creator><scope>EVB</scope></search><sort><creationdate>20211224</creationdate><title>Electrode evaporation equipment and method thereof</title><author>LI JUNSHENG ; SUN HU ; HU GENSHUI ; ZHANG SHENGJUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN113832443A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>LI JUNSHENG</creatorcontrib><creatorcontrib>SUN HU</creatorcontrib><creatorcontrib>HU GENSHUI</creatorcontrib><creatorcontrib>ZHANG SHENGJUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LI JUNSHENG</au><au>SUN HU</au><au>HU GENSHUI</au><au>ZHANG SHENGJUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electrode evaporation equipment and method thereof</title><date>2021-12-24</date><risdate>2021</risdate><abstract>The invention provides electrode evaporation equipment and a method thereof, and belongs to the field of light emitting diode manufacturing. A plating pot comprises an installing plate and a plurality of supporting units, the supporting units are evenly distributed on the plate face of the installing plate, each supporting unit comprises a plurality of telescopic rods and a substrate fixing plate, a substrate of an epitaxial wafer is installed on the substrate fixing plate, the two ends of the multiple telescopic rods in the supporting unit are connected to the installing plate and one end face of the substrate fixing plate correspondingly in a hinged mode, the multiple telescopic rods are distributed in the circumferential direction, the telescopic rods between the substrate fixing plate and the installing plate of the plating pot are controlled to be stretched or shortened, the substrate fixing plate is adjusted to a proper position, so that the shielding of photoresist is avoided, the offset influence of g</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | Electrode evaporation equipment and method thereof |
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