Electrode evaporation equipment and method thereof

The invention provides electrode evaporation equipment and a method thereof, and belongs to the field of light emitting diode manufacturing. A plating pot comprises an installing plate and a plurality of supporting units, the supporting units are evenly distributed on the plate face of the installing plate, each supporting unit comprises a plurality of telescopic rods and a substrate fixing plate, a substrate of an epitaxial wafer is installed on the substrate fixing plate, the two ends of the multiple telescopic rods in the supporting unit are connected to the installing plate and one end face of the substrate fixing plate correspondingly in a hinged mode, the multiple telescopic rods are distributed in the circumferential direction, the telescopic rods between the substrate fixing plate and the installing plate of the plating pot are controlled to be stretched or shortened, the substrate fixing plate is adjusted to a proper position, so that the shielding of photoresist is avoided, the offset influence of g