Multi-patterning method

The invention relates to a manufacturing method of a semiconductor structure and a multi-patterning method. In the manufacturing process of a side wall structure of the multi-patterning method, an atomic layer etching process is adopted when a side wall layer is etched, so that the problems of colla...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LI JUNFENG, WANG WENWU, ZHOU NA, YANG TAO, LI JUNJIE, HUANG YUANTAI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!