Crack parameter evaluation method and device, electronic equipment and medium
The invention discloses a crack parameter evaluation method and device, electronic equipment and a medium. The method may include: identifying a single well crack; calculating the vertical component and the horizontal component of the fracture opening through a double lateral component method evalua...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a crack parameter evaluation method and device, electronic equipment and a medium. The method may include: identifying a single well crack; calculating the vertical component and the horizontal component of the fracture opening through a double lateral component method evaluation model; and according to the vertical component and the horizontal component of the fracture opening, calculating the composite opening, the composite inclination angle and the porosity of the fracture. According to the invention, the depth and depth dual-lateral component opening degree combined model is established, the crack component opening degree is evaluated, then the composite crack opening degree, the composite crack inclination angle and the crack porosity are calculated, quantitative evaluation on the crack through conventional logging is achieved, and a solid foundation is laid for further crack development zone prediction, crack section productivity evaluation and the like in the later period.
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