Epoxy molding compound and preparation method and application thereof

The invention discloses an epoxy molding compound and a preparation method and application thereof. The epoxy molding compound comprises the following raw materials by mass: 50%-90% of a modified inorganic filler, 5%-30% of epoxy resin, 2%-25% of a curing agent, 0.1%-1% of a coupling agent, 0.05%-0.5% of a curing accelerator, 0.5%-10% of a flexibilizer, 0.1%-1% of a release agent and 0.2%-5% of a flame retardant, wherein the modified inorganic filler is a polyethyleneimine modified inorganic filler. By modifying the inorganic filler, the acting force between the filler and the resin can be increased, so that the glass-transition temperature of the epoxy molding compound is increased, and the thermal expansion coefficient of the material is reduced. 本发明公开了一种环氧塑封料及其制备方法和应用，该环氧塑封料按质量百分比计，其原料组成为：改性无机填料50％-90％，环氧树脂5％-30％、固化剂2％-25％，偶联剂0.1％-1％、固化促进剂0.05％-0.5％，增韧剂0.5％-10％，脱模剂0.1％-1％和阻燃剂0.2％-5％；所述改性无机填料为聚乙烯亚胺改性的无机填料。本发明通过对无机填料进行改性，能够加大填料与树脂间的作用力，从而达到提高塑封料的玻璃化转变温度，降低材料的热膨胀系数。