High-survival-rate cutage planting method for pitaya
The invention discloses a high-survival-rate cuttage planting method for pitaya, which comprises the following steps: S1, pretreatment of cuttings: robust branches are selected, yellowing treatment is performed, then the branches are cut off and cut into sections as cuttings; physiological lower end...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a high-survival-rate cuttage planting method for pitaya, which comprises the following steps: S1, pretreatment of cuttings: robust branches are selected, yellowing treatment is performed, then the branches are cut off and cut into sections as cuttings; physiological lower end pulp parts of stem nodes of the cuttings are cut off, and central xylemis retained; S2, preparation of a rooting culture medium: the rooting culture medium is prepared by uniformly spreading rooting water on a rooting substrate; the rooting substrate comprises the following raw materials: saw dust, charcoal, coal slag, vermiculite, sandstone and sphagna; a preparation method of the rooting water comprises the following steps: soaking willow barks in water to obtain a soaking solution; and adding a rare earth salt solution into the soaking solution, and performing stirring and mixing; and S3, rooting culture and transplanting cuttage: after the cuts are air-dried, the cuttings are inserted into the rooting culture |
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