IGBT module cooling method

The invention discloses an IGBT module cooling method. The method comprises the following steps: S1, providing an oven which is provided with a cooling cavity; and S2, placing an IGBT module the cooling cavity of the oven, and cooling the IGBT module. According to the IGBT module cooling method, the...

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Bibliographische Detailangaben
Hauptverfasser:	LUO KAI, CHEN XIAOLEI, YANG XINGYUN, TAO SHAOYONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS,IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KINDOF FURNACE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FURNACES HEATING KILNS LIGHTING MECHANICAL ENGINEERING OVENS RETORTS SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	The invention discloses an IGBT module cooling method. The method comprises the following steps: S1, providing an oven which is provided with a cooling cavity; and S2, placing an IGBT module the cooling cavity of the oven, and cooling the IGBT module. According to the IGBT module cooling method, the cooling cavity is additionally formed in the oven, cooling of the IGBT module is achieved, the cooling efficiency is high, and the production efficiency can be improved. 本发明公开了一种IGBT模块降温方法，包括步骤：S1、提供烤箱，烤箱具有冷却腔；S2、将IGBT模块置于烤箱的冷却腔中，对IGBT模块进行降温。本发明的IGBT模块降温方法，通过在烤箱内部增加冷却腔，实现IGBT模块的降温冷却，降温效率高，有助于提高生产效率。