Method for manufacturing electronic assembly on 3D part and 3D part including electronic assembly
A method of applying an electronic assembly on a 3D part made of a polypropylene-based material is disclosed. The electronic assembly comprises at least one conductive path having a width between 0.1 mm and 4 mm. The method comprises: providing a 3D part made of a polypropylene-based material; selec...
Gespeichert in:
| Hauptverfasser: | , , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | OBIETA VILALLONGA ISABEL BUSTERO MARTINEZ DE ZUAZO IZASKUN BILBAO ALBA LEIRE VAQUERO MORALEJO CELINA MAUDES PUENTEDURA JON |
| description | A method of applying an electronic assembly on a 3D part made of a polypropylene-based material is disclosed. The electronic assembly comprises at least one conductive path having a width between 0.1 mm and 4 mm. The method comprises: providing a 3D part made of a polypropylene-based material; selecting conductive paste; providing a fluid dispensing system (11) for applying the conductive paste to a surface of the 3D part; selecting a nozzle (125) and attaching the selected nozzle to the fluid dispensing system (11); dispensing the selected conductive paste through the nozzle (125) onto the surface of the 3D part by applying a pressure between 0.2 bar and 13 bar while maintaining a maximum distance of 900 [mu]m between the nozzle (125) and the surface of the 3D part; curing the deposited conductive paste; depositing a dielectric ink on a printed conductive path; curing the deposited dielectric ink; and attaching at least one electronic assembly on the conductive path.
将电子组件施加在由聚丙烯基材料制成的3D件上的方法，电子组件包括宽度在0.1mm至 |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN113784532A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN113784532A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN113784532A3</originalsourceid><addsrcrecordid>eNrjZEj0TS3JyE9RSMsvUshNzCtNS0wuKS3KzEtXSM1JTS4pys_LTFZILC5OzU3KqVTIz1MwdlEoSCwqUUjMS4GzM_OSc0pTcGjiYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GhsbmFiamxkaOxsSoAQDPVz1B</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method for manufacturing electronic assembly on 3D part and 3D part including electronic assembly</title><source>esp@cenet</source><creator>OBIETA VILALLONGA ISABEL ; BUSTERO MARTINEZ DE ZUAZO IZASKUN ; BILBAO ALBA LEIRE ; VAQUERO MORALEJO CELINA ; MAUDES PUENTEDURA JON</creator><creatorcontrib>OBIETA VILALLONGA ISABEL ; BUSTERO MARTINEZ DE ZUAZO IZASKUN ; BILBAO ALBA LEIRE ; VAQUERO MORALEJO CELINA ; MAUDES PUENTEDURA JON</creatorcontrib><description>A method of applying an electronic assembly on a 3D part made of a polypropylene-based material is disclosed. The electronic assembly comprises at least one conductive path having a width between 0.1 mm and 4 mm. The method comprises: providing a 3D part made of a polypropylene-based material; selecting conductive paste; providing a fluid dispensing system (11) for applying the conductive paste to a surface of the 3D part; selecting a nozzle (125) and attaching the selected nozzle to the fluid dispensing system (11); dispensing the selected conductive paste through the nozzle (125) onto the surface of the 3D part by applying a pressure between 0.2 bar and 13 bar while maintaining a maximum distance of 900 [mu]m between the nozzle (125) and the surface of the 3D part; curing the deposited conductive paste; depositing a dielectric ink on a printed conductive path; curing the deposited dielectric ink; and attaching at least one electronic assembly on the conductive path.
将电子组件施加在由聚丙烯基材料制成的3D件上的方法，电子组件包括宽度在0.1mm至</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211210&DB=EPODOC&CC=CN&NR=113784532A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211210&DB=EPODOC&CC=CN&NR=113784532A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OBIETA VILALLONGA ISABEL</creatorcontrib><creatorcontrib>BUSTERO MARTINEZ DE ZUAZO IZASKUN</creatorcontrib><creatorcontrib>BILBAO ALBA LEIRE</creatorcontrib><creatorcontrib>VAQUERO MORALEJO CELINA</creatorcontrib><creatorcontrib>MAUDES PUENTEDURA JON</creatorcontrib><title>Method for manufacturing electronic assembly on 3D part and 3D part including electronic assembly</title><description>A method of applying an electronic assembly on a 3D part made of a polypropylene-based material is disclosed. The electronic assembly comprises at least one conductive path having a width between 0.1 mm and 4 mm. The method comprises: providing a 3D part made of a polypropylene-based material; selecting conductive paste; providing a fluid dispensing system (11) for applying the conductive paste to a surface of the 3D part; selecting a nozzle (125) and attaching the selected nozzle to the fluid dispensing system (11); dispensing the selected conductive paste through the nozzle (125) onto the surface of the 3D part by applying a pressure between 0.2 bar and 13 bar while maintaining a maximum distance of 900 [mu]m between the nozzle (125) and the surface of the 3D part; curing the deposited conductive paste; depositing a dielectric ink on a printed conductive path; curing the deposited dielectric ink; and attaching at least one electronic assembly on the conductive path.
将电子组件施加在由聚丙烯基材料制成的3D件上的方法，电子组件包括宽度在0.1mm至</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZEj0TS3JyE9RSMsvUshNzCtNS0wuKS3KzEtXSM1JTS4pys_LTFZILC5OzU3KqVTIz1MwdlEoSCwqUUjMS4GzM_OSc0pTcGjiYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GhsbmFiamxkaOxsSoAQDPVz1B</recordid><startdate>20211210</startdate><enddate>20211210</enddate><creator>OBIETA VILALLONGA ISABEL</creator><creator>BUSTERO MARTINEZ DE ZUAZO IZASKUN</creator><creator>BILBAO ALBA LEIRE</creator><creator>VAQUERO MORALEJO CELINA</creator><creator>MAUDES PUENTEDURA JON</creator><scope>EVB</scope></search><sort><creationdate>20211210</creationdate><title>Method for manufacturing electronic assembly on 3D part and 3D part including electronic assembly</title><author>OBIETA VILALLONGA ISABEL ; BUSTERO MARTINEZ DE ZUAZO IZASKUN ; BILBAO ALBA LEIRE ; VAQUERO MORALEJO CELINA ; MAUDES PUENTEDURA JON</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN113784532A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>OBIETA VILALLONGA ISABEL</creatorcontrib><creatorcontrib>BUSTERO MARTINEZ DE ZUAZO IZASKUN</creatorcontrib><creatorcontrib>BILBAO ALBA LEIRE</creatorcontrib><creatorcontrib>VAQUERO MORALEJO CELINA</creatorcontrib><creatorcontrib>MAUDES PUENTEDURA JON</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OBIETA VILALLONGA ISABEL</au><au>BUSTERO MARTINEZ DE ZUAZO IZASKUN</au><au>BILBAO ALBA LEIRE</au><au>VAQUERO MORALEJO CELINA</au><au>MAUDES PUENTEDURA JON</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for manufacturing electronic assembly on 3D part and 3D part including electronic assembly</title><date>2021-12-10</date><risdate>2021</risdate><abstract>A method of applying an electronic assembly on a 3D part made of a polypropylene-based material is disclosed. The electronic assembly comprises at least one conductive path having a width between 0.1 mm and 4 mm. The method comprises: providing a 3D part made of a polypropylene-based material; selecting conductive paste; providing a fluid dispensing system (11) for applying the conductive paste to a surface of the 3D part; selecting a nozzle (125) and attaching the selected nozzle to the fluid dispensing system (11); dispensing the selected conductive paste through the nozzle (125) onto the surface of the 3D part by applying a pressure between 0.2 bar and 13 bar while maintaining a maximum distance of 900 [mu]m between the nozzle (125) and the surface of the 3D part; curing the deposited conductive paste; depositing a dielectric ink on a printed conductive path; curing the deposited dielectric ink; and attaching at least one electronic assembly on the conductive path.
将电子组件施加在由聚丙烯基材料制成的3D件上的方法，电子组件包括宽度在0.1mm至</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN113784532A |
| source | esp@cenet |
| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Method for manufacturing electronic assembly on 3D part and 3D part including electronic assembly |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-28T12%3A43%3A46IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=OBIETA%20VILALLONGA%20ISABEL&rft.date=2021-12-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN113784532A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |