Method for manufacturing electronic assembly on 3D part and 3D part including electronic assembly

A method of applying an electronic assembly on a 3D part made of a polypropylene-based material is disclosed. The electronic assembly comprises at least one conductive path having a width between 0.1 mm and 4 mm. The method comprises: providing a 3D part made of a polypropylene-based material; selecting conductive paste; providing a fluid dispensing system (11) for applying the conductive paste to a surface of the 3D part; selecting a nozzle (125) and attaching the selected nozzle to the fluid dispensing system (11); dispensing the selected conductive paste through the nozzle (125) onto the surface of the 3D part by applying a pressure between 0.2 bar and 13 bar while maintaining a maximum distance of 900 [mu]m between the nozzle (125) and the surface of the 3D part; curing the deposited conductive paste; depositing a dielectric ink on a printed conductive path; curing the deposited dielectric ink; and attaching at least one electronic assembly on the conductive path. 将电子组件施加在由聚丙烯基材料制成的3D件上的方法，电子组件包括宽度在0.1mm至