Method for improving warpage of printed circuit board, and anti-warpage printed circuit board

The invention provides a method for improving warpage of a printed circuit board, and an anti-warpage printed circuit board. The anti-warpage printed circuit board comprises a plurality of working boards, the plurality of working boards comprise a plurality of working board surface layers which are...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	XU XIANSHANG, HUANG YAFEI, ZHANG GUIWU, GU MANMAN, XIANG ZHIJUN, LIU HUI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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