Method for improving warpage of printed circuit board, and anti-warpage printed circuit board

The invention provides a method for improving warpage of a printed circuit board, and an anti-warpage printed circuit board. The anti-warpage printed circuit board comprises a plurality of working boards, the plurality of working boards comprise a plurality of working board surface layers which are symmetrical pairwise, each working board comprises a process frame and a plurality of board groups, each board group comprises a board group frame and at least two unit boards, at least one process frame is provided with a frame optimization structure, or at least one plate group frame is provided with a frame optimization structure, or at least one process frame and at least one plate group frame are provided with frame optimization structures, so that the residual copper rate difference value between every two symmetrical working plate surface layers is smaller than or equal to 10%. According to the invention, based on the characteristics of the printed circuit board and the characteristics of influencing the ben