Anti-warping printed circuit board, and method for improving warping of printed circuit board

The invention provides an anti-warping printed circuit board, and a method for improving the warping of the printed circuit board. The anti-warping printed circuit board comprises a plurality of working boards, the plurality of working boards comprise a plurality of pairwise symmetrical working boar...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: XU XIANSHANG, HUANG YAFEI, ZHANG GUIWU, GU MANMAN, XIANG ZHIJUN, LIU HUI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides an anti-warping printed circuit board, and a method for improving the warping of the printed circuit board. The anti-warping printed circuit board comprises a plurality of working boards, the plurality of working boards comprise a plurality of pairwise symmetrical working board surface layers, each working board comprises a process frame and a plurality of board groups, each board group comprises a board group frame and at least two unit boards, at least one unit board is provided with an in-board optimization structure, and the in-board optimization structure includes a plurality of first square non-functional pads. On the basis of the characteristics of the printed circuit board and the characteristics influencing the bending, the internal stress of the board is eliminated through the in-board optimization structure comprising the first square non-functional bonding pads, the delivery period is not prolonged, the cost is not increased, the influence of machine type space and the influ