Manufacturing method of bonded wafer and wafer bonding machine

The invention discloses a manufacturing method of a bonded wafer and a wafer bonding machine table. The manufacturing method of the bonded wafer comprises the following steps of: providing a pretreated warming-up sheet which is provided with a porous structure internally loaded with an aqueous solution; conveying the pretreated warm-up sheet to a plasma reaction chamber, and making the pretreated warm-up sheet stand still for a preset time under a preset pressure; providing at least two to-be-bonded wafers for the plasma reaction chamber; activating the surfaces of the at least two to-be-bonded wafers; cleaning the at least two to-be-bonded wafers subjected to activation treatment; and bonding the cleaned at least two to-be-bonded wafers to obtain the bonded wafer. According to the manufacturing method of the bonded wafer provided by the invention, the pretreated warm-up sheet is provided for the plasma reaction chamber before the surfaces of the at least two to-be-bonded wafers are activated, so that suffici