Chip package and method of forming same

A structure of a chip package and a method of forming the structure are provided. The method includes disposing a semiconductor die over a carrier substrate. The method also includes disposing an interposer substrate over the carrier substrate. The interposer substrate is provided with a groove, and the groove passes through the opposite surface of the interposer substrate. The interposer substrate has an interior sidewall surrounding a semiconductor die, and the semiconductor die is equal to or higher than the interposer substrate. The method also includes forming a protective layer in the recess of the interposer substrate to surround the semiconductor die. In addition, the method includes removing a carrier substrate and a package-on-package structure over the interposer substrate. 提供芯片封装的结构及其形成方法。此方法包含：设置半导体晶粒于载体基板之上。此方法也包含设置中介层基板于此载体基板之上。此中介层基板具有凹槽，此凹槽穿过该中介层基板的相反面。此中介层基板具有围绕半导体晶粒的内部侧壁，并且此半导体晶粒等高于或高于此中介层基板。此方法还包含在中介层基板的凹槽中形成保护层，以围绕半导体晶粒。另外，此方法包含移除载体基板以及堆叠封装结构于该中介层基板之上。