SEMICONDUCTOR MANUFACTURING APPARATUS AND OPERATING METHOD THEREOF
Disclosed are semiconductor manufacturing apparatuses and operating methods thereof. The semiconductor manufacturing apparatus includes an oscillation unit that includes a first seed laser, a second seed laser, and a seed module, wherein the first seed laser oscillates a first pulse, and wherein the...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | Disclosed are semiconductor manufacturing apparatuses and operating methods thereof. The semiconductor manufacturing apparatus includes an oscillation unit that includes a first seed laser, a second seed laser, and a seed module, wherein the first seed laser oscillates a first pulse, and wherein the second seed laser oscillates a second pulse, and an extreme ultraviolet generation unit configured to use the first and second pulses to generate extreme ultraviolet light. The seed module includes a plurality of mirrors configured to allow the first and second pulses to travel along first and second paths, respectively, and a pulse control optical system including a first optical element, a second optical element, and a third optical element. The pulse control optical system is on the second path that does not overlap the first path. The third optical element includes a lens between the first optical element and the second optical element.
公开了半导体制造装置及其操作方法。半导体制造装置包括振荡单元和极紫外生成单元,振荡单元包括第一种子激光器、第二种子激光器和种子模块,其中,第一种子激 |
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