Method for testing curing shrinkage rate of glue

The invention provides a method for testing the curing shrinkage rate of glue, which comprises the following steps: placing a flexible part provided with a through hole on the upper surface of a first substrate, injecting glue into the through hole of the flexible part, and attaching the lower surfa...

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1. Verfasser: HOU FENGCHAO
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention provides a method for testing the curing shrinkage rate of glue, which comprises the following steps: placing a flexible part provided with a through hole on the upper surface of a first substrate, injecting glue into the through hole of the flexible part, and attaching the lower surface of a second substrate to the top of the flexible part and the glue; measuring the distance between the first substrate and the second substrate at a measurement position to obtain a first distance; after the glue is solidified, measuring the distance between the first substrate and the second substrate at the measurement position so as to obtain a second distance; and calculating the first spacing and the second spacing to obtain the curing shrinkage rate of the glue. A test scene is built by using the first substrate, the second substrate and the flexible part with the through hole, the glue curing shrinkage rate is obtained by measuring and calculating the distance between the first substrate and the second su