METHOD FOR DETACHING AN INSULATION LAYER FROM A CONDUCTOR WIRE END
The invention relates to a method and an apparatus (3) for detaching an insulation layer (1) from an end of a conductor wire (2). The insulator layer is connected to conductor by means of an adhesion layer (9), wherein said adhesion layer is destroyed between the conductor wire (2) and the insulatio...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a method and an apparatus (3) for detaching an insulation layer (1) from an end of a conductor wire (2). The insulator layer is connected to conductor by means of an adhesion layer (9), wherein said adhesion layer is destroyed between the conductor wire (2) and the insulation layer (1) such that surface pressure is repeatedly applied to the entire surface of the insulation layer to be detached.
本发明涉及用于将绝缘层(1)从导线端部(2)分离的方法和设备。绝缘层经由附着层(9)与导体连接,其中通过如下方式破坏在导线(2)和绝缘层(1)之间的所述附着层,即重复地将面压力施加到绝缘层(1)的整个要分离的表面上。 |
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