Photosensitive element
A photosensitive element disclosed by the present invention includes an integrated circuit structure, a first pad and a second pad exposed from a surface of the integrated circuit structure, a first material layer is disposed on the surface and covers the first pad, and a second material layer is di...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A photosensitive element disclosed by the present invention includes an integrated circuit structure, a first pad and a second pad exposed from a surface of the integrated circuit structure, a first material layer is disposed on the surface and covers the first pad, and a second material layer is disposed on the first material layer and covers the second pad, wherein the first material layer and the second material layer form a photodiode.
本发明公开一种感光元件,包括一集成电路结构,一第一接垫和一第二接垫自该集成电路结构的一表面显露出来,一第一材料层设置在该表面上并且覆盖该第一接垫,以及一第二材料层设置在该第一材料层上并且覆盖该第二接垫,其中该第一材料层和该第二材料层构成一光电二极管。 |
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