Photosensitive element

A photosensitive element disclosed by the present invention includes an integrated circuit structure, a first pad and a second pad exposed from a surface of the integrated circuit structure, a first material layer is disposed on the surface and covers the first pad, and a second material layer is di...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: JIANG XIAOHONG, ZHAN ZHAOYAO, DAI JINHUA, DING QIANWEI
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A photosensitive element disclosed by the present invention includes an integrated circuit structure, a first pad and a second pad exposed from a surface of the integrated circuit structure, a first material layer is disposed on the surface and covers the first pad, and a second material layer is disposed on the first material layer and covers the second pad, wherein the first material layer and the second material layer form a photodiode. 本发明公开一种感光元件,包括一集成电路结构,一第一接垫和一第二接垫自该集成电路结构的一表面显露出来,一第一材料层设置在该表面上并且覆盖该第一接垫,以及一第二材料层设置在该第一材料层上并且覆盖该第二接垫,其中该第一材料层和该第二材料层构成一光电二极管。