SIP packaging structure based on embedded integrated pull-up and pull-down resistor IPD

The invention discloses an SIP packaging structure based on an embedded integrated pull-up and pull-down resistor IPD, and belongs to the field of packaging integration. The structure comprises a packaging substrate, a chip and a printed circuit board. An embedded integrated pull-up and pull-down resistor IPD is embedded in the packaging substrate to complete pull-up and pull-down functions of various different levels; the chip is mounted at the top of the packaging substrate; the printed circuit board is installed at the bottom of the packaging substrate. According to the embedded integrated pull-up and pull-down resistor IPD, pull-up and pull-down bias of a chip circuit port can be realized, the port of the chip is interconnected with a power supply end and a ground end, special design can be carried out according to different requirements, and the connection mode cannot be changed after being fixed. According to the SIP packaging structure based on the embedded integrated pull-up and pull-down resistor IPD