Semiconductor element bonding equipment and using method thereof

The invention discloses semiconductor element combining equipment and a using method thereof. The semiconductor element combining equipment comprises a base, a longitudinal beam is arranged on the base, an upper sliding rail, a lower sliding rail and a third telescopic air cylinder are arranged on o...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JIANG ZHENRONG, ZHOU HAISHENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS ORMACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS,CLIPS, WEDGES, JOINTS OR JOINTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS THERMAL INSULATION IN GENERAL WEAPONS
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