Semiconductor element bonding equipment and using method thereof
The invention discloses semiconductor element combining equipment and a using method thereof. The semiconductor element combining equipment comprises a base, a longitudinal beam is arranged on the base, an upper sliding rail, a lower sliding rail and a third telescopic air cylinder are arranged on o...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses semiconductor element combining equipment and a using method thereof. The semiconductor element combining equipment comprises a base, a longitudinal beam is arranged on the base, an upper sliding rail, a lower sliding rail and a third telescopic air cylinder are arranged on one side of the longitudinal beam, a suspension is arranged on the upper sliding rail in a sliding mode, a first sliding rail and a second sliding rail are arranged below the suspension, and a dispensing assembly is arranged on the first sliding rail in a sliding mode; a combination assembly is arranged on the second sliding rail in a sliding mode, a suspension is arranged on the upper sliding rail on the longitudinal beam in a sliding mode and controlled to move up and down through a third telescopic air cylinder, and the combination assembly and a dispensing assembly are arranged below the suspension in a sliding mode. The supporting box can be controlled through the first telescopic air cylinder, the second teles |
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