Semiconductor structure, packaging structure and packaging method

The embodiment of the invention provides a semiconductor structure. The semiconductor structure comprises a first semiconductor device and a second semiconductor device, a first set of conductive connectors mechanically and electrically bonding the first semiconductor device to the second semiconduc...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHEN SHUOMAO, ZHUANG BOYAO, ZHENG XINPU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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