Semiconductor structure, packaging structure and packaging method

The embodiment of the invention provides a semiconductor structure. The semiconductor structure comprises a first semiconductor device and a second semiconductor device, a first set of conductive connectors mechanically and electrically bonding the first semiconductor device to the second semiconductor device; a first underfill between the first semiconductor device and the second semiconductor device and surrounding the first set of conductive connectors; a first encapsulant on at least sidewalls of the first and second semiconductor devices and the first underfill; and a second set of conductive connectors electrically coupled to the first semiconductor device; the second set of conductive connectors and the first set of conductive connectors are located on opposite sides of the first semiconductor device. The invention also provides a packaging structure and a packaging method. 本公开实施例提供一种半导体结构，包括一第一半导体装置和一第二半导体装置、一第一组导电连接器将第一半导体装置机械地和电性地接合到第二半导体装置、一第一底部填充剂位于第一半导体装置和第二半导体装置之间并围绕第一组导电连接器、一第一密封剂位于第一半导体装置和第二半导