Integrated circuit and method for forming integrated circuit

The present disclosure discloses an integrated circuit having a plurality of dies stacked along a direction and a method of forming the integrated circuit. In one aspect, the integrated circuit includes a first die, a second die, and a third die stacked along one direction. In one aspect, the first die includes a first interface circuit for generating a signal. In one aspect, the second die includes a second interface circuit for receiving a signal from the first interface circuit and generating a replica signal of the signal. In one aspect, the third die includes a third interface circuit to receive the replica signal from the second interface circuit. 本揭示文件揭露了一种集成电路以及集成电路的形成方法，此集成电路具有多个沿着一个方向堆叠的裸晶。在一种态样中，集成电路包含沿着一个方向堆叠的第一裸晶、第二裸晶以及第三裸晶。在一种态样中，第一裸晶包含一个第一接口电路，用来产生信号。在一种态样中，第二裸晶包含一个第二接口电路，用来接收来自于第一接口电路的信号，以及产生此信号的复制信号。在一种态样中，第三裸晶包含一个第三接口电路，用来接收来自于第二接口电路的复制信号。