COIL COMPONENT

Disclosed is a coil component that includes a support substrate, a coil portion disposed on at least one surface of the support substrate, a body including the support substrate and the coil portion disposed therein, an external electrode disposed on a surface of the body and connected to the coil p...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ANG JU-HWAN, KANG BYUNG-SOO, PARK NO-IL, LIM SEUNG-MO, MOON BYEONGOL
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:Disclosed is a coil component that includes a support substrate, a coil portion disposed on at least one surface of the support substrate, a body including the support substrate and the coil portion disposed therein, an external electrode disposed on a surface of the body and connected to the coil portion, and an insulating layer disposed in a region of the surface of the body other than a region in which the external electrode is disposed, wherein an average roughness (Ra) of the surface of the body in contact with the external electrode is different from an average roughness (Ra) of the surface of the body in contact with the insulating layer. 本公开提供一种线圈组件,所述线圈组件包括:支撑基板;线圈部,设置在所述支撑基板的至少一个表面上;主体,所述支撑基板和所述线圈部设置在所述主体中;外电极,设置在所述主体的至少一个表面上并且连接到所述线圈部;以及绝缘层,设置在所述主体的至少一个表面的除了设置有所述外电极的区域之外的区域中,其中,所述主体的与所述外电极接触的表面的平均粗糙度(Ra)与所述主体的与所述绝缘层接触的表面的平均粗糙度(Ra)不同。