ELECTRIC DEVICE

An electric device (1) includes: a circuit substrate (10); a heat sink (20); a first connection part (22) electrically connecting the heat sink (20) with the circuit substrate (10); a second connection part (21) electrically connecting the heat sink (20) with an electroconductive frame by coming int...

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Bibliographische Detailangaben
Hauptverfasser: IRIFUNE YOSHIAKI, FUJITA TOKUJI, TAKANO KAZUKI, SAITO TATSUYA, WADA KENJI, HARUNA NOBUYUKI, KASAHARA SHIMPEI, YONEOKA TAKEHIRO, NIWA KENTA
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:An electric device (1) includes: a circuit substrate (10); a heat sink (20); a first connection part (22) electrically connecting the heat sink (20) with the circuit substrate (10); a second connection part (21) electrically connecting the heat sink (20) with an electroconductive frame by coming into contact with the electroconductive frame. The circuit substrate (10) is provided with: a frame ground pattern electrically connected to the heat sink (20) via the first connection part (22); a signal ground pattern constituting a return path which forms a pair with a wiring between the first connector (11) and an electronic component; and a circuit element (12) electrically connecting the frame ground pattern with the signal ground pattern. The first connector (11), the circuit element (12), the first connection part (22), and the second connection part (21) are aligned along an edge of the circuit substrate (10). 电子设备(1)具有:电路基板(10)、散热器(20)、将散热器(20)和电路基板(10)电连接的第1连接部(22)、以及通过与导电性框架接触而将散热器(20)和导电性框架电连接的第2连接部(21)。电