Integrated circuit manufacturing system

An embodiment of the present invention provides an integrated circuit manufacturing system, comprising: a chamber in which integrated circuit manufacturing is performed on a substrate; a heating device, used for heating the substrate in the manufacturing process of the integrated circuit; and a substrate holding device, used for securing the substrate in the chamber during fabrication of the integrated circuit, wherein the substrate holding device includes a base having a substantially circular surface and a cylindrical surface extending from the substantially circular surface, and a continuous annular portion, disposed within the base and having a contact surface defined on the annular portion, wherein the contact surface is configured to contact an edge of the substrate being held, the substrate holding device not contacting a circumferential surface of the substrate being held. 本发明的实施例提供了一种集成电路制造系统，包括：室，在所述室中对衬底进行集成电路制造；加热装置，用于在所述集成电路制造过程中加热所述衬底；和衬底保持器件，用于在所述集成电路制造期间将所述衬底固定在所述室中，其中所述衬底保持器件包括：基部，具有基本圆形表面和从基