COOLING APPARATUS, SUBSTRATE PROCESSING APPARATUS, COOLING METHOD, AND SUBSTRATE PROCESSING METHOD

The invention relates to a cooling device, and the cooling device is provided with a flow path through which a cold medium can flow; a condenser provided in the flow path; a heat exchanger provided in the flow path; a compressor provided in the flow path between the condenser and the heat exchanger; a cooler for cooling the cold medium flowing from the condenser into the heat exchanger; a gas cooling unit for supplying a gas to the heat exchanger and cooling the gas by heat exchange with the cold medium; a first thermometer capable of detecting the temperature of the cooled gas; a second thermometer capable of detecting the temperature of the cold medium flowing into the heat exchanger; and a first control unit capable of controlling, by means of the cooler, the temperature of the cooling medium flowing into the heat exchanger. 本发明所涉及的冷却装置具备：流路，可使冷介质流通；凝结器，设置于所述流路；换热器，设置于所述流路；压缩机，设置于所述凝结器与所述换热器之间的所述流路；冷却器，冷却从所述凝结器流入所述换热器的所述冷介质；气体冷却部，向所述换热器供给气体，通过与所述冷介质之间的换热可冷却所述气体；第1温度计，可检测被冷却的所述气体的温度；第2温度计，可检测流入所述换热器的所述冷介质的温