Packaging frame, packaging structure and preparation method of packaging frame

The invention relates to the technical field of power electronics, and particularly provides a packaging framework, a packaging structure and a preparation method of the packaging framework, the framework comprises a first surface and a second surface which are oppositely arranged, the first surface...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WU JIAMENG, GUO YITENG, ZENG DAN, LIANG SAICHANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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