Packaging frame, packaging structure and preparation method of packaging frame

The invention relates to the technical field of power electronics, and particularly provides a packaging framework, a packaging structure and a preparation method of the packaging framework, the framework comprises a first surface and a second surface which are oppositely arranged, the first surface is provided with a mounting part, and a third surface of the mounting part is connected with a to-be-mounted part. A distance in the first direction exists between the first surface and the third surface, and a distance in the second direction exists between the edge of the mounting part and the peripheral side of the to-be-mounted part. The position of the welding flux is limited through the arrangement of the distance between the first surface and the third surface in the first direction, when the to-be-installed part is installed on the third surface, the redundant welding flux moves towards the side edge away from the to-be-installed part, and the position of the welding flux is limited through the distance be