Electromagnetic thermal reliability life analysis method

The invention provides an electromagnetic thermal reliability life analysis method, and belongs to the field of radio frequency microsystems, and the method specifically comprises the steps: firstly obtaining an S parameter result of an interconnection structure, constructing an interconnection structure equivalent circuit, and extracting equivalent resistance; secondly, carrying out reliability life prediction, specifically, setting variable parameters firstly, and modeling a geometric model in a parametric mode; taking a thermal-force direct coupling unit as a calculation unit, and carrying out grid division on the geometric model; applying input power to the interconnection structure, and calculating to obtain heating power; setting symmetrical boundary conditions and applying temperature impact load conditions; taking an Anand viscoplastic model as a constitutive model, carrying out transient simulation solving of a structural field on the geometric model, and then obtaining the viscoplastic strain energy