Method for drawing bonding pads of printed circuit board

The embodiment of the invention provides a method for drawing bonding pads of a printed circuit board. The method comprises the following steps of: determining the number and the size of bonding pads on a printed circuit board; determining the number of welding pins according to the number of the bonding pads; putting solder paste points on a solder paste material plate according to the number and the size of the bonding pads; moving the welding pins to insert the welding pins into the solder paste points, and enabling the welding pins to make contact with the solder paste material plate; heating the welding pins to melt the solder paste points to form solder balls; moving the welding pins to enable the solder balls to be in contact with the bonding pads so as to complete welding of the welding pins and the bonding pads; and drawing the welding pins to separate the bonding pads from the printed circuit board. According to the technical scheme, the method is suitable for testing the bonding strength of the bon