PROTECTIVE ELEMENTS FOR BONDED STRUCTURES

A bonded structure is disclosed. The bonded structure can include a semiconductor element comprising an active circuitry and a first bonding layer. The bonded structure can include a protective element directly bonded to the semiconductor element without an adhesive along a bonding interface. The protective element can include an obstructive material disposed over the active circuitry and a second bonding layer on the obstructive material. The second bonding layer can be directly bonded to the first bonding layer without an adhesive. The obstructive material can be configured to obstruct external access to the active circuitry. 公开了一种键合结构。键合结构可以包括半导体元件，该半导体元件包括有源电路装置和第一键合层。键合结构可以包括保护元件，该保护元件沿键合界面被直接键合到半导体元件而无需粘合剂。保护元件可以包括被设置在有源电路装置之上的阻碍材料和在阻碍材料上的第二键合层。第二键合层可以被直接键合到第一键合层而无需粘合剂。阻碍材料可以被配置为阻碍对有源电路装置的外部接入。