Semiconductor package, semiconductor device and method of forming same

A semiconductor device including a cover having a liquid cooling channel and a method of forming the same are disclosed. In an embodiment, the semiconductor device includes: a first integrated circuit die; a cap coupled to the first integrated circuit die, the cap including a plurality of channels i...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SHAO DONGLIANG, XIAO SHENGCONG, WU ZHONGRONG, DONG ZHIHANG, WANG RENYOU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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