Semiconductor package, semiconductor device and method of forming same

A semiconductor device including a cover having a liquid cooling channel and a method of forming the same are disclosed. In an embodiment, the semiconductor device includes: a first integrated circuit die; a cap coupled to the first integrated circuit die, the cap including a plurality of channels in a surface of the cap opposite the first integrated circuit die; a cooling cap coupled to the cap opposite the first integrated circuit die; and a heat transfer unit coupled to the cooling cap by a pipe fitting, the heat transfer unit configured to supply a liquid coolant to the plurality of channels through the cooling cap. The embodiment of the invention provides a semiconductor package, a semiconductor device and a forming method thereof. 公开了包括具有液冷通道的盖的半导体器件及其形成方法。在实施例中，半导体器件包括：第一集成电路管芯；盖，耦合至第一集成电路管芯，该盖包括位于盖的与第一集成电路管芯相反的表面中的多个通道；冷却盖，与第一集成电路管芯相反地耦合至盖；以及传热单元，通过管配件耦合至冷却盖，该传热单元被配置为通过冷却盖将液体冷却剂供应至多个通道。本申请的实施例提供了半导体封装件、半导体器件及其形成方法。