Chip module and electronic equipment

The invention provides a chip module and electronic equipment. The chip module comprises a circuit board, a slot formed in the surface of one side of the circuit board, a top-cover-free packaging chip, a radiator and a substrate fixing assembly. The top-cover-free packaging chip comprises a substrate and a bare chip packaged on the substrate. The slot is electrically connected with the circuit board, the top-cover-free packaging chip is provided with a connecting part at the side, deviated from the bare chip, of the substrate, and the connecting part is connected with the slot in an inserted mode, so that the connecting part is connected with an elastic terminal in the slot in a pressing mode. The radiator is pressed at the side, deviated from the circuit board, of the bare chip so as to press the middle part of the top-cover-free packaging chip to the slot, so that the connecting part in the middle part of the top-cover-free packaging chip is reliably pressed and connected with the elastic terminal in the sl