Sensor structure, preparation method thereof and electronic equipment

The invention provides a sensor structure, a preparation method thereof, and electronic equipment. The sensor structure comprises a silicon substrate; a film layer structure arranged on one side of the silicon substrate, wherein a cavity is formed in the side, away from the film layer structure, of...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	XIAO SUYAN, HU WEI, MU PEIXIANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING
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