Semiconductor packaging structure

The invention discloses a semiconductor packaging structure, and the structure comprises a packaging substrate which is provided with a first surface and a second surface opposite to the first surface; at least one semiconductor die on the first surface of the package substrate and surrounded by a package layer; a cap structure surrounding the encapsulation layer and spaced apart from the encapsulation layer, wherein the cover structure comprises a first opening, and the first opening is covered by the first surface of the package substrate; and a first electronic component over the first surface of the package substrate and disposed within the first opening of the cover structure. In this way, the electronic component does not occupy an additional position on the first surface of the package substrate, so that the width of the cover structure does not need to be reduced in order to make space for the electronic component, the width of the cover structure can be larger, the cover structure can cover the packa