Preparation method of suction cup structure forming mold and preparation method of suction cup structure

The invention relates to a preparation method of a suction cup structure forming mold, which adopts an electrochemical corrosion process to carry out isotropic polishing on a micro-nano structure array on a moderately doped silicon substrate so as to convert the micro-nano structure array into a suc...

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Hauptverfasser: WANG WEI, ZHENG DEYIN
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention relates to a preparation method of a suction cup structure forming mold, which adopts an electrochemical corrosion process to carry out isotropic polishing on a micro-nano structure array on a moderately doped silicon substrate so as to convert the micro-nano structure array into a suction cup array. The sucker array prepared by the method is good in consistency, and the size of the sucker array can be conveniently adjusted by adjusting the corrosion current and the corrosion time of electrochemical corrosion. The invention further relates to a preparation method of the suction cup structure, according to the method, the suction cup structure can be prepared through the suction cup structure forming mold through a two-time mold overturning technology, repeatability is good, the technology is simple, consumed time is short, and the batch machining cost is low. 本发明涉及一种吸盘结构成型模具的制备方法,该方法采用电化学腐蚀工艺对中度掺杂硅衬底上的微纳结构阵列进行各向同性抛光,从而将微纳结构阵列转化为吸盘阵列。由该方法制得的吸盘阵列一致性好,并且通过调节电化学腐蚀的腐蚀电流和腐蚀时间,可以方便地调节吸盘阵列的尺寸。本发明还涉及一种吸盘