ELECTRONIC COMPONENT PACKAGING COVER TAPE AND PACKAGE

The present invention provides a cover tape which is for packaging electronic components and which has: a base material layer; a heat seal layer that is disposed on one surface side of the base material layer and that contains an ethylene-vinyl acetate copolymer and a polyethylene resin; and an anti...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	INOUE MASAKUNI, NAGATSUKA YASUNORI, YANAGISAWA SHUNPEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING HANDLING THIN OR FILAMENTARY MATERIAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS STORING TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention provides a cover tape which is for packaging electronic components and which has: a base material layer; a heat seal layer that is disposed on one surface side of the base material layer and that contains an ethylene-vinyl acetate copolymer and a polyethylene resin; and an antistatic layer disposed on a surface side opposite to the surface on the side of the heat seal layer of the base material layer. 本发明提供一种电子部件包装用覆盖带，其具有：基材层；热密封层，其配置于上述基材层的一面侧，包含乙烯-乙酸乙烯酯共聚物及聚乙烯树脂；以及抗静电层，其配置于上述基材层的与上述热密封层侧的面相反的面侧。